Semiconductor package and method for fabricating base for semiconductor package

ABSTRACT

The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.

CROSS REFERENCE TO RELATED APPLICATIONS

This Application is a Continuation of U.S. application Ser. No.15/194,658, filed Jun. 28, 2016, entitled “SEMICONDUCTOR PACKAGE ANDMETHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE”, which is aContinuation of U.S. application Ser. No. 14/173,976, filed Feb. 6,2014, entitled “SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASEFOR SEMICONDUCTOR PACKAGE”, which is a Division of U.S. application Ser.No. 13/721,983, filed Dec. 20, 2012, entitled “SEMICONDUCTOR PACKAGE ANDMETHOD FOR FABRICATING BASE FOR SEMICONDUCTOR PACKAGE”, which claimspriority to U.S. Provisional Application Ser. No. 61/677,835, filed Jul.31, 2012, entitled “FLIP CHIP BUMP ON EMBEDDED TRACE SUBSTRATE”. Theentire contents of these applications are incorporated herein byreference in their entirety.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a semiconductor package and a methodfor fabricating a base for a semiconductor package, and in particular,to a base for a high density semiconductor package.

Description of the Related Art

In order to ensure miniaturization and multi-functionality of electronicproducts or communication devices, semiconductor packages are desired tobe small in size, to support multi-pin connection, to support highspeeds, and to support high functionality. The demand for increasingInput-Output (I/O) pin counts and high-performance ICs has led to thedevelopment of flip chip packages.

Flip-chip technology uses bumps on a chip to interconnect to a packagesubstrate. The flip-chip is bonded face down to the package substratethrough the shortest path. The technology used can be applied not onlyto a single-chip package, but also to higher or integrated levels ofpackaging in which the packages are larger and packaged with moresophisticated substrates that accommodate several chips to form largerfunctional units. The flip-chip technique, using an area array, canachieve a high density interconnection with devices and a very lowinductance interconnection with packaging. However, this requiresprinted circuit board (PCB) fabricators to minimize line widths andspace or to develop direct chip attach (DCA) semiconductors.Accordingly, the increased amount of input/output connections of amulti-functional flip-chip package may induce thermal electricalproblems, for example, problems with heat dissipation, cross talk,signal propagation delay, electromagnetic interference for RF circuits,etc. The thermal electrical problems may affect the reliability andquality of products.

Thus, a novel high-density flip chip package and a printed circuit boardfor a high-density flip chip package are desirable.

BRIEF SUMMARY OF INVENTION

A semiconductor package and a method for fabricating a base for asemiconductor package are provided. An exemplary embodiment of asemiconductor package includes a conductive trace embedded in a base. Asemiconductor device is mounted on the conductive trace via a conductivestructure.

Another exemplary embodiment of a semiconductor package includes aconductive trace, having a bottom surface and at least a portion of asidewall connected to a base. A semiconductor device is mounted on theconductive trace via a conductive structure.

An exemplary embodiment of a method for fabricating a base for asemiconductor package includes providing a carrier with conductive seedlayers on a top surface and a bottom surface of the carrier. Firstconductive traces are respectively formed on the top surface and thebottom surface of the carrier, connecting to the conductive seed layers.A first base material layer and a second base material layer arerespectively laminated on the top surface and the bottom surface of thecarrier, covering the first conductive traces. Second conductive tracesare respectively formed on first surfaces of the first base materiallayer and the second base material layer, wherein the first surfaces ofthe first base material layer and the second base material layer arerespectively away from the top surface and the bottom surface of thecarrier. The first base material layer with the first and secondconductive traces thereon and the second base material layer with thefirst and second conductive traces thereon are separated from thecarrier to form a first base and a second base.

Another exemplary embodiment of a method for fabricating a semiconductorpackage includes providing a base, forming a conductive trace on thebase, further forming an additional insulation material on the base, andfurther defining patterns upon the additional insulation material,wherein the pattern is formed on at least one conductive trace.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

The invention can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1 to 4 show cross sections of various exemplary embodiments of asemiconductor package of the invention.

FIGS. 5a to 5e are cross sections showing one exemplary embodiment of amethod for fabricating a base for a semiconductor package of theinvention.

FIGS. 6a to 6e are cross sections showing another exemplary embodimentof a method for fabricating a semiconductor package of the invention.

DETAILED DESCRIPTION OF INVENTION

The following description is a mode for carrying out the invention. Thisdescription is made for the purpose of illustrating the generalprinciples of the invention and should not be taken in a limiting sense.The scope of the invention is best determined by reference to theappended claims. Wherever possible, the same reference numbers are usedin the drawings and the descriptions to refer the same or like parts.

The present invention will be described with respect to particularembodiments and with reference to certain drawings, but the invention isnot limited thereto and is only limited by the claims. The drawingsdescribed are only schematic and are non-limiting. In the drawings, thesize of some of the elements may be exaggerated and not drawn to scalefor illustrative purposes. The dimensions and the relative dimensions donot correspond to actual dimensions to practice of the invention.

FIGS. 1 to 4 show cross sections of various exemplary embodiments of asemiconductor package of the invention. In this embodiment, thesemiconductor package can be a flip chip package using conductivestructures, for example, copper pillar bumps, connecting a semiconductordevice to a base. Alternatively, the semiconductor package can be apackage using wire bonding technology to connect a semiconductor deviceto a base. FIG. 1 shows a partial cross section of one exemplaryembodiment of a semiconductor package 500 a of the invention. Pleaserefer to FIG. 1, wherein the semiconductor package 500 a comprises abase 200 having a device attach surface 214. In one embodiment, the base200, for example, a print circuit board (PCB), may be formed ofpolypropylene (PP). It should be also noted that the base 200 can be asingle layer or a multilayer structure. A plurality of conductive traces202 a is embedded in the base 200. In one embodiment, the conductivetraces 202 a may comprise signal trace segments or ground tracesegments, which are used for input/output (I/O) connections of asemiconductor device 300 mounted directly onto the base 200. Therefore,each of the conductive traces 202 a has a portion serving as a padregion of the base 200. In this embodiment, the conductive traces 202 aare designed to have a width which is larger than 5 μm. However, itshould be noted that there is no limitation on the width of theconductive traces. For different designs, the width of the conductivetraces can be smaller than 5 μm if required.

A semiconductor device 300 is mounted on the device attach surface 214of the base 200 with an active surface of the semiconductor device 300facing the base 200 by a bonding process. In one embodiment, thesemiconductor device 300 may comprise a die, a passive component, apackage or a wafer level package. In this embodiment, the semiconductordevice 300 is a flip chip package. A circuitry of the semiconductordevice 300 is disposed on the active surface, and metal pads 304 aredisposed on a top of the circuitry. The circuitry of the semiconductordevice 300 is interconnected to the circuitry of the base 200 via aplurality of conductive structures 222 disposed on the active surface ofthe semiconductor device 300. However, it should be noted that theconductive structures 222 shown in FIG. 1 is only an example and is nota limitation to the present invention.

As shown in FIG. 1, the semiconductor device 300 may include a body 301,metal pads 304 overlying the semiconductor body 301, and an insulationlayer 302 covering the metal pads 304. In this embodiment, thesemiconductor body 301 may include but is not limited to a semiconductorsubstrate, circuit elements fabricated on the main surface of thesemiconductor substrate, inter-layer dielectric (ILD) layers and aninterconnection structure. In one embodiment, the interconnectionstructure may comprise a plurality of metal layers, a plurality ofdielectric layers alternatively laminated with the metal layers and aplurality of vias formed through the dielectric layers on thesemiconductor substrate. The metal pads 304 comprise the topmost metallayer of the metal layers of the interconnection structure. In oneembodiment, the insulation layer 302 may be a single layer structure ora multilayer structure, and the insulation layer 302 may comprise but isnot limited to silicon nitride, silicon oxide, silicon oxynitride,polyimide or any combination thereof. Also, the insulation layer 302 mayhave functions of stress buffering and insulation. In one embodiment,the metal pad 304 may comprise but is not limited to aluminum, copper oralloys thereof. A plurality of openings can be formed in the insulationlayer 302. Each of the openings exposes at least a portion of one of themetal pads 304.

As shown in FIG. 1, the conductive structure 222 may comprise aconductive bump structure such as a copper bump or a solder bumpstructure, a conductive wire structure, or a conductive paste structure.In this embodiment, the conductive structure 222 may be a copper bumpstructure composed of a metal stack comprising a UBM (under bumpmetallurgy) layer 306, a copper layer 216 such as a plated copper layer,a conductive buffer layer 218, and a solder cap 220. In one embodiment,the UBM layer 306 can be formed on the exposed metal pads 304 within theopenings by a deposition method such as a sputtering or plating methodand a subsequent anisotropic etching process. The anisotropic etchingprocess is performed after forming conductive pillars. The UBM layer 306may also extend onto a top surface of the insulation layer 302. In thisembodiment, the UBM layer 306 may comprise titanium, copper or acombination thereof. A copper layer 216 such as an electroplated copperlayer can be formed on the UBM layer 306. The opening can be filled withthe copper layer 216 and the UBM layer 306, and the copper layer 216 andthe UBM layer 306 within the opening may form an integral plug of theconductive structure 222. A formation position of the copper layer 216is defined by a dry film photoresist or liquid photoresist patterns (notshown).

A solder cap 220 can be formed on the copper layer 216 by electroplatinga solder with a patterned photoresist layer or by a screen printingprocess and a subsequent solder re-flow process. A conductive bufferlayer 218 formed of Ni may be formed between the copper layer 216 andthe solder cap 220 by an electroplating method. The conductive bufferlayer 218 may serve as a seed layer, adhesion layer and barrier layerfor the solder cap 220 formed thereon. In this embodiment, theconductive structure 222, such as a conductive pillar structure, is usedas a solder joint for the metal pad 304, which transmits input/output(I/O), ground or power signals of the semiconductor device 300 formedthereon. Therefore, the copper layer 216 of the conductive structure 222may help to increase the mechanical strength of the bump structure. Inone embodiment, an underfill material or the underfill 230 can beintroduced into the gap between the semiconductor device 300 and thebase 200. In one embodiment, the underfill 230 may comprises a capillaryunderfill (CUF), molded underfill (MUF) or a combination thereof.

In one embodiment, the conductive traces may have a top surface disposedabove, below or aligned to a surface of the base to improve routingability for high-density semiconductor packages. As shown in FIG. 1, theconductive traces 202 a have top surfaces 212 a disposed below a deviceattach surface 214 of the base 200. That is to say, a bottom surface 206a and at least a portion of a sidewall 204 a of the conductive trace 202a are designed to be connected to the base 200. In this embodiment, thesolder cap 220 of the conductive structure 222 is disposed to contactwith a portion of the base 200 and to connect to a top surface 212 a ofthe conductive trace 202 a only. Due to the top surfaces of theconductive traces being recessed from the device attach surface 214 ofthe base 200, the bump-to-trace space is increased and the problem ofbump-to-trace bridging can be effectively avoided.

FIG. 2 shows a partial cross section of another exemplary embodiment ofa semiconductor package 500 b of the invention. Elements of theembodiments that are the same or similar as those previously describedwith reference to FIG. 1, are hereinafter not repeated for brevity. Inthis embodiment, conductive traces 202 b of the semiconductor package500 b embedded in the base 200 may have a top surface 212 b designed tobe aligned to a device attach surface 214 of the base 200 to improverouting ability for high-density semiconductor packages. That is to say,a bottom surface 206 b and a sidewall 204 b of the conductive trace 202b are designed to be fully connected to the base 200. Therefore, thesolder cap 220 of the conductive structure 222 is disposed on the deviceattach surface 214 of the base 200, contacting the top surface 212 b ofthe conductive trace 202 b only.

FIG. 3 shows a partial cross section of yet another exemplary embodimentof a semiconductor package 500 c of the invention. Elements of theembodiments that are the same or similar as those previously describedwith reference to FIGS. 1 and 2, are hereinafter not repeated forbrevity. In this embodiment, conductive traces 202 c of thesemiconductor package 500 c embedded in the base 200 may have a topsurface 212 c designed above a device attach surface 214 of the base 200to improve routing ability for high-density semiconductor packages. Thatis to say, a bottom surface 206 c and only a portion of a sidewall 204 cof the conductive trace 202 c are designed to be connected to the base200. Therefore, the solder cap 220 of the conductive structure 222 isdisposed on the device attach surface 214 of the base 200, wrapping atop surface 212 c and only a portion of the sidewall 204 c of theconductive trace 202 c.

FIG. 4 shows a partial cross section of still another exemplaryembodiment of a semiconductor package 500 d of the invention. Elementsof the embodiments that are the same or similar as those previouslydescribed with reference to FIGS. 1-3, are hereinafter not repeated forbrevity. In one embodiment, the base may comprise a single layerstructure as shown in FIGS. 1-3. Alternatively, the base may comprise amultilayer structure. In this embodiment, conductive traces 202 d of thesemiconductor package 500 d embedded in the base portion 200 a may havea top surface 212 d designed to be aligned to a surface 214 of the baseportion 200 a to improve routing ability for high-density semiconductorpackages. That is to say, a bottom surface 206 d and a sidewall 204 d ofthe conductive trace 202 d are designed to be connected to the baseportion 200 a. Also, an insulation layer 208 having openings 210 isdisposed on the base portion 200 a. The insulation layer 208 is disposedabove the device attach surface 214 of the conductive trace 202 d. Inthis embodiment, the base portion 200 a and the insulation layer 208collectively serve as a multilayer base. As shown in FIG. 4, theconductive traces 202 d are exposed within the openings 210. Therefore,the solder cap 220 of the conductive structure 222 is formed through aportion of the insulation layer 208, contacting a top surface 212 d ofthe conductive trace 202 d only. It should be noted that it is notnecessary for the insulation layer 208 to align with the sidewall 204 dof the conductive traces 202 d. Instead, it can be designed to bedistanced outward or inward from the sidewall 204 d of the conductivetraces 202 d as shown in FIG. 4.

FIGS. 5a to 5d are cross sections showing one exemplary embodiment of amethod for fabricating two bases 200 c and 200 d for a semiconductorpackage of the invention. In this embodiment, the method for fabricatingbases for a semiconductor package is also called a double-sided basefabricating process. Elements of the embodiments that are the same orsimilar as those previously described with reference to FIGS. 1-4, arehereinafter not repeated for brevity. As shown in FIG. 5a , a carrier400 with conductive seed layers 402 a and 402 b on a top surface 401 anda bottom surface 403 is provided. In one embodiment, the carrier 400 maycomprise FR4 glass epoxy or stainless steel. Also, the conductive seedlayers 402 a and 402 b are used as seed layers for subsequently formedinterconnection conductive traces of bases on the top surface 401 andthe bottom surface 403 of the carrier 400. In one embodiment, theconductive seed layers 402 a and 402 b may comprise copper.

Next, as shown in FIG. 5b , first conductive traces 404 a and 404 b arerespectively formed on the top surface 401 and the bottom surface 403 ofthe carrier 400. Bottom portions of the first conductive traces 404 aand 404 b connect to top portions of the conductive seed layers 402 aand 402 b. In one embodiment, the first conductive traces 404 a and 404b may be formed by a plating process and an anisotropic etching process.The plating process and the anisotropic etching process aresimultaneously performed on the top surface 401 and the bottom surface403 of the carrier 400. In one embodiment, the plating process maycomprise an electrical plating process. In one embodiment, the firstconductive traces 404 a and 404 b may comprise copper. In oneembodiment, the first conductive traces 404 a and 404 b are designed tohave a width which is larger than 5 μm. However, it should be noted thatthere is no limitation on the width of the conductive traces. Fordifferent designs, the width of the conductive traces can be smallerthan 5 μm if required. In this embodiment, the anisotropic etchingprocess may precisely control the width of the first conductive traces404 a and 404 b.

Next, as shown in FIG. 5c , a laminating process is performed torespectively dispose a first base material layer 406 a and a second basematerial layer 406 b on the top surface 401 and the bottom surface 403of the carrier 400, wherein the first base material layer 406 a and asecond base material layer 406 b respectively cover the first conductivetraces 404 a and 404 b. In this embodiment, the laminating process ofthe first base material layer 406 a and the second base material layer406 b is simultaneously performed on the on the top surface 401 and thebottom surface 403 of the carrier 400. In one embodiment, the first basematerial layer 406 a and the second base material layer 406 b maycomprise polypropylene (PP).

Next, please refer to FIG. 5c again, wherein a drilling process isperformed to form openings (not shown) through the first base materiallayer 406 a and the second base material layer 406 b to define theformation positions of subsequently formed vias 408 a and 408 b. In oneembodiment, the drilling process may comprise a laser drilling process,an etching drilling process or a mechanical drilling process. Next, aplating process is performed to fill a conductive material into theopenings to form vias 408 a and 408 b for interconnecting the firstconductive traces 404 a and 404 b to subsequent second conductive traces410 a and 410 b. In this embodiment, the drilling process and theplating process are simultaneously performed on the first base materiallayer 406 a and the second base material layer 406 b, respectively.

Next, please refer to FIG. 5c again, wherein a plurality of secondconductive traces 410 a and 410 b are respectively formed on a firstsurface 412 of the first base material layer 406 a and a first surface414 of the second base material layer 406 b. As shown in FIG. 5c , thefirst surface 412 of the first base material layer 406 a and the firstsurface 414 of the second base material layer 406 b are respectivelyaway from the top surface 401 and the bottom surface 403 of the carrier400. The second conductive traces 410 a and 410 b are formed by aplating process and an anisotropic etching process. The plating processand the anisotropic etching process are simultaneously performed on thefirst surface 412 of the first base material layer 406 a and the firstsurface 414 of the second base material layer 406 b. In one embodiment,the plating process may comprise an electrical plating process. In oneembodiment, the second conductive traces 410 a and 410 b may comprisecopper. In one embodiment, the second conductive traces 410 a and 410 bare designed to have a width which is larger than 5 nm. However, itshould be noted that there is no limitation on the width of theconductive traces. For different designs, the width of the conductivetraces can be smaller than 5 nm if required. In this embodiment, theanisotropic etching process may precisely control the width of thesecond conductive traces 410 a and 410 b.

Next, as shown in FIG. 5d , the first base material layer 406 a with thefirst and second conductive traces 404 a and 410 a thereon and thesecond base material layer 406 b with the first and second conductivetraces 404 b and 410 b thereon are respectively separated from the topsurface 401 and the bottom surface 403 of the carrier 400 to form afirst base 200 c and a second base 200 d which are separated from eachother. Next, as shown in FIG. 5d again, the conductive seed layers 402 aand 402 b are removed from the first base 200 c and the second base 200d, respectively.

As shown in FIGS. 5d and 5e , the first conductive traces 404 a and 404b are aligned to second surfaces 416 and 418 of the of the first andsecond bases 200 c and 200 d, which are respectively opposite to thefirst surfaces 412 and 414. In this embodiment, the first base 200 c andthe second base 200 d are simultaneously fabricated on opposite surfaces(the top surface 401 and the bottom surface 403) by the double-sidedbase fabricating process.

Alternatively, two passivation or insulation layers (not shown) havingopenings may be optionally formed respectively on a second surface 416of the first base 200 c and the second surface 418 of the second base200 d after the separation of the first base 200 c and the second base200 d as shown in FIGS. 5d and 5e . In this embodiment, the firstconductive traces 404 a and 404 b of the first and second bases 200 cand 200 d are exposed within the opening. Positions of the insulationlayer with openings and the first conductive traces 404 a/404 b as shownin FIG. 5d /5 e can be similar to the insulation layer 208 with openings210 and the conductive traces 202 d as shown in FIG. 4. Also, in thisembodiment, the first base 200 a/second base 200 b and the insulationlayer thereon collectively serve as a multilayer base.

FIGS. 6a to 6e are cross sections showing another exemplary embodimentof a method for making a semiconductor package of the invention. Also,FIG. 6e shows a cross section of another exemplary embodiment of asemiconductor package 500 e of the invention. Elements of theembodiments that are the same or similar as those previously describedwith reference to FIGS. 1-4 and 5 a-5 e, are hereinafter not repeatedfor brevity. Alternatively, the base may have a multilayer structure. Asshown in FIG. 6a , a base 450 with a top surface 451 is provided. Next,as shown in FIG. 6b , at least one conductive trace 454 is formed on thetop surface 451 of the base 450. In one embodiment, the conductive trace454 may be formed by a plating process and an anisotropic etchingprocess. In one embodiment, the plating process may comprise anelectrical plating process. In one embodiment, the conductive trace 454may comprise copper. In one embodiment, the conductive trace 454 isdesigned to have a width which is larger than 5 μm. However, it shouldbe noted that there is no limitation on the width of the conductivetraces. For different designs, the width of the conductive traces can besmaller than 5 μm if required. In this embodiment, the anisotropicetching process may precisely control the width of the conductive trace454.

Next, as shown in FIG. 6c , a laminating process is performed torespectively dispose an additional insulation material 456 on the topsurface 451 of the base 450. Also, the additional insulation material456 covers a top surface 460 and sidewalls 462 of the conductive trace454.

Next, please refer to FIG. 6d , wherein a drilling process is performedto form at least one opening 458 through the additional insulationmaterial 456 to define formation of a position of a subsequently formedconductive structure, for example, a copper bump structure or a solderbump structure. In one embodiment, the drilling process may comprise alaser drilling process, an etching drilling process or a mechanicaldrilling process. In this embodiment, the top surface 460 of theconductive trace 454 is exposed within the opening 458 of the additionalinsulation material 456.

Next, as shown in FIG. 6e , a bonding process is performed to mount asemiconductor device 300 on the base 450 through the conductivestructure 222. Elements of the semiconductor device 300 and theconductive structure 222 that are the same or similar as thosepreviously described with reference to FIGS. 1-4, are hereinafter notrepeated for brevity. After the bonding process, the conductivestructures 222 are disposed through the opening 458 of the additionalinsulation material 456, contacting to the top surface 460 of theconductive trace 454 only. Next, an underfill material or the underfill230 can be introduced into the gap between the semiconductor device 300and the additional insulation material 456. In one embodiment, theunderfill 230 may comprises a capillary underfill (CUF), moldedunderfill (MUF) or a combination thereof. Finally, the base 450, theadditional insulation material 456, the semiconductor device 300, theconductive trace 454, and the conductive structure 222 collectively forma semiconductor package 500 e.

Exemplary embodiments provide a semiconductor package. The semiconductorpackage is designed to comprise conductive trace embedded in a base, forexample, a print circuit board (PCB). The conductive traces may have atop surface disposed above, below or aligned to a surface of the base toimprove routing ability for high-density semiconductor packages. Also,the conductive traces are designed to have a width which is larger than5 μm. Further, the base may comprise a single layer structure or amultilayer structure. Exemplary embodiments also provide a method forfabricating a base for a semiconductor package. In one embodiment, themethod can fabricate two bases on two sides of a carrier simultaneously.Also, the conductive traces may be embedded in the base. Further, theconductive trace may be formed by a plating process and an anisotropicetching process, and the anisotropic etching process may preciselycontrol the width of the conductive trace. Alternatively, the method canfabricate a base comprising a single layer structure or a multilayerstructure to improve design capability.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. On the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A semiconductor package, comprising: a basecomprising a recess; a copper trace embedded in the recess such that atop surface of the copper trace is below a top surface of the base,wherein the top surface of the copper trace is exposed within therecess; and a semiconductor device mounted on the copper trace via aconductive structure that is in direct contact with the top surface ofthe copper trace, wherein at least a portion of the conductive structureat or above the top surface of the base has a width that is greater thana width of the copper trace.
 2. The semiconductor package of claim 1,wherein a bottom surface of the recess and at least one side wall of therecess are formed of a same insulative material.
 3. The semiconductorpackage of claim 1, wherein the base covers an entirety of a bottomsurface of the copper trace underneath the conductive structure.
 4. Thesemiconductor package of claim 1, wherein the copper trace is elongatedand carries a signal or a ground across at least a portion of the base.5. The semiconductor package of claim 1, wherein the conductivestructure is in contact with a portion of the top surface of the baseand with a side wall of the recess.
 6. The semiconductor package ofclaim 1, wherein the conductive structure comprises a conductive pillarstructure comprising an under bump metallurgy (UBM) layer, a copperlayer, a solder cap and a conductive buffer layer between the copperlayer and the solder cap.
 7. The semiconductor package of claim 6,wherein the UBM layer contacts an exposed portion of a metal pad of thesemiconductor device, and wherein the solder cap is in contact with atleast a portion of the top surface of the base, at least one side wallof the recess and the top surface of the copper trace.
 8. Asemiconductor package, comprising: a base comprising a top surface and arecess having an insulative bottom surface below the top surface; aconductive trace embedded in the recess such that the conductive traceis in contact with the insulative bottom surface, wherein a top surfaceof the conductive trace is below the top surface of the base; and asemiconductor device mounted on the conductive trace via a conductivestructure, wherein at least a portion of the conductive structure at orabove the top surface of the base has a width that is greater than awidth of the conductive trace, wherein the conductive trace is elongatedand carries a signal or a ground across at least a portion of the base.9. The semiconductor package of claim 8, wherein the conductivestructure is in contact with an entire width of the top surface of theconductive trace.
 10. The semiconductor package of claim 8, wherein theinsulative bottom surface of the recess and at least one side wall ofthe recess are formed of a same insulative material.
 11. Thesemiconductor package of claim 8, wherein the semiconductor devicecomprises a body having a first surface, a metal pad on the firstsurface, and an insulation layer covering at least a portion of thefirst surface of the body and a portion of the metal pad, wherein anexposed portion of the metal pad is mounted on the conductive trace viathe conductive structure.
 12. The semiconductor package of claim 8, andwherein the top surface of the conductive trace and a bottom surface ofthe conductive trace have a same width.
 13. The semiconductor package ofclaim 12, wherein the width of the top surface of the conductive traceand the bottom surface of the conductive trace is the same as a width ofa bottom surface of the recess.
 14. The semiconductor package of claim8, wherein the conductive trace is a single layer.
 15. The semiconductorpackage of claim 14, wherein the base covers an entirety of a bottomsurface of the conductive trace underneath the conductive structure. 16.The semiconductor package of claim 8, further comprising: an underfillbetween the semiconductor device and the base.
 17. The semiconductorpackage of claim 16, wherein the underfill comprises capillary underfill(CUF), molded underfill (MUF), nonconductive paste (NCP), nonconductivefilm (NCF) or a combination thereof.
 18. The semiconductor package ofclaim 8, wherein the conductive structure comprises a conductive pillarstructure comprising an under bump metallurgy (UBM) layer, a copperlayer, a solder cap and a conductive buffer layer between the copperlayer and the solder cap.
 19. The semiconductor package of claim 18,wherein the copper layer has a width that is greater than a width of theconductive trace.
 20. The semiconductor package of claim 18, wherein theUBM layer contacts an exposed portion of a metal pad of thesemiconductor device, and wherein the solder cap is in contact with atleast a portion of the top surface of the base, at least one side wallof the recess and the top surface of the conductive trace.